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Integrated Circuits (ICs)

BD7602GUL-E2

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Rohm Semiconductor

POWER MANAGEMENT IC FOR NEAR FIELD COMMUNICATION LSI

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Integrated Circuits (ICs)

BD7602GUL-E2

Active
Rohm Semiconductor

POWER MANAGEMENT IC FOR NEAR FIELD COMMUNICATION LSI

Technical Specifications

Parameters and characteristics for this part

SpecificationBD7602GUL-E2
ApplicationsNFC, LDO
Mounting TypeSurface Mount
Number of Outputs2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-35 °C
Package / CaseCSPBGA, 9-UFBGA
Supplier Device Package9-VCSP50L1C
Supplier Device Package [x]1.6
Supplier Device Package [y]1.6
Voltage - Input [Max]5.5 V
Voltage - Input [Min]2.7 V
Voltage - Output3 V
Voltage - Output [Max]3.3 V
Voltage - Output [Min]2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.46
3000$ 0.46

Description

General part information

BD7602GUL Series

BD7602GUL is a Power Management IC for mobile device with NFC IC. Each LDO output is controlled by 2 line serial interface which supports I²C Bus protocol. This helps to save space to integrate all PMIC for NFC IC.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance with the ELV directive

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Six Steps for Successful Thermal Design of LDO Regulator ICs

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Thermal Calculation for Linear Regulator

Thermal Design

What Is Thermal Design

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

How to Use the Two-Resistor Model

Thermal Design

BD7602GUL Data Sheet

Data Sheet

PCB Layout Thermal Design Guide

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Reverse Voltage Protection

Schematic Design & Verification

Power Source ON/OFF Characteristics for Linear Regulator

Schematic Design & Verification

Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)

Schematic Design & Verification

Thermal Resistance

Thermal Design

Power Supply Sequence Circuit with General Purpose Power Supply IC

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter

Schematic Design & Verification

Calculating Junction Temperature from Inrush Current

Thermal Design

Connecting LDOs in Parallel

Schematic Design & Verification

Problem Situations: Power Supply Does Not Start

Schematic Design & Verification

Basics of Linear Regulators

Schematic Design & Verification

Factory Information

Manufacturing Data

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Simple Test Method for Estimating the Stability of Linear Regulators

Schematic Design & Verification

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design