TC399XP256F300SBDKXUMA2
ActiveSAK-TC399XP-256F300S BD IS AURIX™ MCU WITH 6 CORES AT 300 MHZ, 16 MB FLASH, 2.9 MB SRAM, AND ISO 26262 COMPLIANT. FIND DATA SHEET, PARAMETERS AND ORDERING INFO
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TC399XP256F300SBDKXUMA2
ActiveSAK-TC399XP-256F300S BD IS AURIX™ MCU WITH 6 CORES AT 300 MHZ, 16 MB FLASH, 2.9 MB SRAM, AND ISO 26262 COMPLIANT. FIND DATA SHEET, PARAMETERS AND ORDERING INFO
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Technical Specifications
Parameters and characteristics for this part
| Specification | TC399XP256F300SBDKXUMA2 |
|---|---|
| Connectivity | MSC, CANbus, SENT, PSI5, QSPI, Ethernet, LINbus, ASC, FlexRay, HSSL, I2C |
| Core Processor | TriCore™ |
| Core Size | 32 Bit, 10 Core |
| EEPROM Size | 1M |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 516-LFBGA |
| Peripherals | WDT, PWM, DMA, LVDS |
| Program Memory Size | 16 MB |
| Program Memory Type | FLASH |
| RAM Size | 2.47 M |
| Speed | 300 MHz |
| Supplier Device Package | PG-LFBGA-516-10 |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 2.97 V |
| Part | RAM Size | Program Memory Type | Data Converters [custom] | Data Converters [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Supplier Device Package | Speed | Oscillator Type | Core Size | Connectivity | Peripherals | Voltage - Supply (Vcc/Vdd) | Program Memory Size | Core Processor | Package / Case | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 INFINEON | 2.75K x 8 | FLASH | 12 | 100 | 125 °C | -40 °C | Surface Mount | PG-LFBGA-516-5 | 300 MHz | Internal | 6 Core 32 Bit | ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI QSPI SENT | DMA WDT | 3.3 V 5 V | 16 MB | TriCore™ | 516-LFBGA | ||||
INFINEON | FLASH | 125 °C | -40 °C | Surface Mount | PG-LFBGA-516-10 | 300 MHz | Internal | 10 Core 32 Bit | ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI5 QSPI SENT | DMA LVDS PWM WDT | 16 MB | TriCore™ | 516-LFBGA | 2.47 M | 1M | 5.5 V | 2.97 V | ||||
INFINEON | FLASH | 150 °C | -40 °C | Surface Mount | PG-LFBGA-516-10 | 300 MHz | Internal | 10 Core 32 Bit | ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI5 QSPI SENT | DMA LVDS PWM WDT | 16 MB | TriCore™ | 516-LFBGA | 2.47 M | 1M | 5.5 V | 2.97 V | ||||
INFINEON | 2.75K x 8 | FLASH | 150 °C | -40 °C | Surface Mount | PG-LFBGA-516-10 | 300 MHz | Internal | 6 Core 32 Bit | ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI QSPI SENT | DMA I2S LVDS PWM WDT | 3.3 V 5 V | 16 MB | TriCore™ | 516-LFBGA |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
TC399XP256 Series
Infineon releases its second generation AURIX microcontroller in embedded flash 40 nm technology. It comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive trends and challenges. This family has more than 20 products to provide the most scalable portfolio of safety microcontroller. In terms of performance, the highest end productTC39xoffers 6 cores running at 300 MHz and up to 6.9 MBytes embedded RAM, and consuming below 2 W. Its mirrored embedded flash banks offers A/B swap capabilities.
Documents
Technical documentation and resources