Infineon’s AIROC™ CYBLE-022001-00 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’sPSoC™ 4 MCU with AIROC™ Bluetooth® LE. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.1, helping cutdown the additional time needed for design, development and certification. It is available in 10 x 10 x 1.80 mm SMT form-factor, with a Chip antenna and is certified to FCC, ISED, MIC, and CE regulations. Infineon’s AIROC™ CYBLE-022001-00 module comes with support for Infineon's CAPSENSE™, the industry-leading capacitive-sensing solution. This module is based on scalable and reconfigurable platform architecture, combining programmable and reconfigurable analog and digital blocks for flexible automatic routing. It is fully integrated with onboard crystal oscillator, passive components, flash memory, up to 18 capacitive sensors for buttons or sliders and the PSOC™ 4 MCU with AIROC™ Bluetooth® LE. This highly integrated module is globally certified to support fast time-to-market. Infineon’s AIROC™ CYBLE-022001-00 module complies with Bluetooth® core specification version 5.1 and has gone through SIG qualification with Updated Declaration IDU048555and QDID141250. Infineon’s AIROC™ CYBLE-022001-00 module is designed to support a wide spectrum of cost optimized Bluetooth® applications.