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Technical Specifications

Parameters and characteristics for this part

SpecificationADPA7008AEHZ
Current - Supply1.5 A
Frequency (Max)54 GHz
Frequency (Min)20 GHz
Gain15.5 dB
Mounting TypeSurface Mount
P1dB30 dBm
Package / Case18-LCQFN Exposed Pad
Package Length7 mm
Package Name18-CLCC
Package Width7 mm
RF TypeGeneral Purpose
Test Frequency (Maximum)40 GHz
Test Frequency (Minimum)22 GHz
Voltage - Supply4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyStrip 1$ 451.44<1d
10$ 401.37
25$ 384.08

CAD

3D models and CAD resources for this part

Description

General part information

ADPA7008 Series

The ADPA7008CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 31 dBm saturated output power (1 W) distributed power amplifier that operates from 20 GHz to 54 GHz. The amplifier provides a gain of 18 dB, an output power for 1 dB compression (P1dB) of 30.5 dBm, and a typical output third-order intercept (IP3) of 38 dBm at 22 GHz to 42 GHz. The ADPA7008CHIP requires 1500 mA from a 5 V supply voltage (VDD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the RFIN and RFOUT pads connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length.APPLICATIONSMilitary and spaceTest instrumentationSatellite communications