Zenode.ai Logo
Beta
ONSEMI BAS40LT1G
Discrete Semiconductor Products

BAS40-05HYFHT116

Active
Rohm Semiconductor

40V, 120MA, SOT-23, CATHODE COMMON, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Deep-Dive with AI

Search across all available documentation for this part.

ONSEMI BAS40LT1G
Discrete Semiconductor Products

BAS40-05HYFHT116

Active
Rohm Semiconductor

40V, 120MA, SOT-23, CATHODE COMMON, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationBAS40-05HYFHT116
Current - Average Rectified (Io) (per Diode)120 mA
Current - Reverse Leakage @ Vr10 µA
Diode Configuration1 Pair Common Cathode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSOT-23-3, TO-236-3, SC-59
QualificationAEC-Q101
Speed200 mA
SpeedAny Speed
Supplier Device PackageSOT-23
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V
Voltage - Forward (Vf) (Max) @ If [Max]1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5271$ 0.64
NewarkEach (Supplied on Cut Tape) 1$ 0.72
10$ 0.47
25$ 0.41
50$ 0.36
100$ 0.30
250$ 0.27
500$ 0.23
1000$ 0.21

Description

General part information

BAS40-05HYFH Series

BAS40-05HYFH is low VFand high reliability Automotive Schottky Barrier Diode, suitable for small current rectification. Very common package SOT-23 and high productive efficiency help your design better. This product complies AEC-Q101 Automotive Grade.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Anti-Whisker formation - Diodes

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

About Export Regulations

Export Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Taping Information

Package Information

Diode Types and Applications

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Package Dimensions

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information