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RSDT27RSMTFTL1
Circuit Protection

RSDT27RSMTFTL1

Active
Rohm Semiconductor

22V 1500W, HIGHLY RELIABLE, TRANSIENT VOLTAGE SUPPRESSOR FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENOverview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)+37
RSDT27RSMTFTL1
Circuit Protection

RSDT27RSMTFTL1

Active
Rohm Semiconductor

22V 1500W, HIGHLY RELIABLE, TRANSIENT VOLTAGE SUPPRESSOR FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsTechnical Data Sheet ENOverview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)+37

Technical Specifications

Parameters and characteristics for this part

SpecificationRSDT27RSMTFTL1
Current - Peak Pulse (10/1000µs)42.3 A
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseTO-277, 3-PowerDFN
Power - Peak Pulse1.5 kW
Power - Peak Pulse1500 W
Power Line ProtectionFalse
QualificationAEC-Q101
Supplier Device PackageTO-277A
TypeZener
Unidirectional Channels [custom]1
Voltage - Breakdown (Min) [Min]24 V
Voltage - Reverse Standoff (Typ) [Max]22 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3990$ 1.97
NewarkEach (Supplied on Cut Tape) 1$ 2.05
10$ 1.60
25$ 1.45
50$ 1.29
100$ 1.13
250$ 1.02
500$ 0.91
1000$ 0.78

Description

General part information

RSDT27RSMTF Series

RSDT27RSMTF is high reliability TVS Diode which is AEC-Q101 qualified, for surge protection and voltage regulation.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Selection Method and Usage of TVS Diodes

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

TO-277GE Dimensions

Package Information

Anti-Whisker formation - Diodes

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

About Flammability of Materials

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Compliance of the RoHS directive

Environmental Data

PCB Layout for TVS Diodes

Schematic Design & Verification

Part Explanation

Application Note

Differences between TVS and Zener Diodes

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

What Are TVS Diodes?

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Diode Types and Applications

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design