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200WFBGA
Integrated Circuits (ICs)

W66BP6NBUAFJ TR

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Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

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200WFBGA
Integrated Circuits (ICs)

W66BP6NBUAFJ TR

Active
Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics for this part

SpecificationW66BP6NBUAFJ TR
Access Time3.5 ns
Clock Frequency1600 MHz
Memory FormatDRAM
Memory InterfaceLVSTL_11
Memory Organization128M x 16
Memory Size2 Gbit
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]105 °C
Operating Temperature [Min]-40 °C
Package / Case200-WFBGA
Supplier Device Package200-WFBGA (10x14.5)
TechnologySDRAM - Mobile LPDDR4
Voltage - Supply [Max]1.17 V, 1.95 V
Voltage - Supply [Min]1.7 V, 1.06 V
Write Cycle Time - Word, Page18 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 5.14
Tape & Reel (TR) 2500$ 3.37

Description

General part information

W66BP6 Series

SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)