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Discrete Semiconductor Products

RFV8TG6SGC9

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Rohm Semiconductor

DIODE STANDARD 600V 8A TO220ACFP

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Product dimension image
Discrete Semiconductor Products

RFV8TG6SGC9

Active
Rohm Semiconductor

DIODE STANDARD 600V 8A TO220ACFP

Technical Specifications

Parameters and characteristics for this part

SpecificationRFV8TG6SGC9
Current - Average Rectified (Io)8 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeThrough Hole
Operating Temperature - Junction [Max]150 °C
Package / CaseTO-220-2
Reverse Recovery Time (trr)45 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-220ACFP
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.64
887$ 0.64

Description

General part information

RFV8TG6S Series

RFV8TG6S is the silicon epitaxial planar type Fast Recovery Diode for PFC.

Documents

Technical documentation and resources

List of Diode Package Thermal Resistance

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Taping Information

Package Information

Inner Structure

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

RFV8TG6S Data Sheet

Data Sheet

About Flammability of Materials

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

About Export Regulations

Export Information

Explanation for Marking

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Reliability Test Result

Manufacturing Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

Anti-Whisker formation - Diodes

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Diode Types and Applications

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article