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Discrete Semiconductor Products

DAN202UMTL

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, DUAL COMMON CATHODE, 80 V, 100 MA, 1.2 V, 4 NS, 4 A

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Product dimension image
Discrete Semiconductor Products

DAN202UMTL

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, DUAL COMMON CATHODE, 80 V, 100 MA, 1.2 V, 4 NS, 4 A

Technical Specifications

Parameters and characteristics for this part

SpecificationDAN202UMTL
Current - Average Rectified (Io) (per Diode)100 mA
Current - Reverse Leakage @ Vr100 nA
Diode Configuration1 Pair Common Cathode
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSC-85
Reverse Recovery Time (trr)4 ns
Speed200 mA
SpeedAny Speed
Supplier Device PackageUMD3F
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If [Max]1.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.24
10$ 0.14
100$ 0.09
500$ 0.07
1000$ 0.06
Digi-Reel® 1$ 0.24
10$ 0.14
100$ 0.09
500$ 0.07
1000$ 0.06
N/A 10889$ 0.22
Tape & Reel (TR) 3000$ 0.03
6000$ 0.03
9000$ 0.03
15000$ 0.03
21000$ 0.03
NewarkEach (Supplied on Cut Tape) 1$ 0.20
10$ 0.13
25$ 0.11
50$ 0.08
100$ 0.06
250$ 0.06
500$ 0.05
1000$ 0.05
TMEN/A 1$ 0.23
10$ 0.14
100$ 0.10
200$ 0.09
500$ 0.07

Description

General part information

DAN202 Series

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

Documents

Technical documentation and resources

Compliance of the RoHS directive

Environmental Data

Reliability Test Result

Manufacturing Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

DAN202UM Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

Anti-Whisker formation - Diodes

Package Information

Diode Types and Applications

Technical Article

Taping Information

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

List of Diode Package Thermal Resistance

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

ESD Data

Characteristics Data

Package Dimensions

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Explanation for Marking

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Inner Structure

Package Information

UMD3 Part Marking

Related Document

UMD3 T106 Taping Spec

Datasheet