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RS3E095BNGZETB

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Rohm Semiconductor

NCH 30V 9.5A MIDDLE POWER MOSFET

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Discrete Semiconductor Products

RS3E095BNGZETB

Active
Rohm Semiconductor

NCH 30V 9.5A MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRS3E095BNGZETB
Current - Continuous Drain (Id) @ 25°C9.5 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs8.3 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]680 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs14.6 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2500$ 1.23

Description

General part information

RS3E095BN Series

RS3E095BN is low on-resistance and small surface mount package MOSFET for switching application.

Documents

Technical documentation and resources

Taping Information

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Inner Structure

Package Information

RS3E095BN Data Sheet

Data Sheet

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Anti-Whisker formation - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Types and Features of Transistors

Application Note

ESD Data

Characteristics Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Explanation for Marking

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Flammability of Materials

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Export Regulations

Export Information

PCB Layout Thermal Design Guide

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification