Integrated Circuits (ICs)
DS34S132GNA2+
UnknownAnalog Devices Inc./Maxim Integrated
IC TELECOM INTERFACE 676TEPBGA
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DocumentsDS34S132GNA2+ | Datasheet
Integrated Circuits (ICs)
DS34S132GNA2+
UnknownAnalog Devices Inc./Maxim Integrated
IC TELECOM INTERFACE 676TEPBGA
Deep-Dive with AI
DocumentsDS34S132GNA2+ | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | DS34S132GNA2+ |
|---|---|
| Function | TDM-over-Packet (TDMoP) |
| Interface | TDMoP |
| Mounting Type | Surface Mount |
| Number of Circuits | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 C |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-TEPBGA |
| Supplier Device Package [x] | 27 |
| Supplier Device Package [y] | 27 |
| Voltage - Supply | 3.3 V, 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | Updated |
|---|---|---|---|---|
Description
General part information
DS34S132 Series
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
Documents
Technical documentation and resources