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676-TEPBGA
Integrated Circuits (ICs)

DS34S132GNA2+

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Analog Devices Inc./Maxim Integrated

IC TELECOM INTERFACE 676TEPBGA

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676-TEPBGA
Integrated Circuits (ICs)

DS34S132GNA2+

Active
Analog Devices Inc./Maxim Integrated

IC TELECOM INTERFACE 676TEPBGA

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationDS34S132GNA2+
FunctionTDM-over-Packet (TDMoP)
InterfaceTDMoP
Mounting TypeSurface Mount
Number of Circuits1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case676-BGA
Supplier Device Package676-TEPBGA (27x27)
Voltage - Supply1.8 V, 3.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

DS34S132 Series

Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)

Documents

Technical documentation and resources