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RRR040P03HZGTL
Discrete Semiconductor Products

RRR040P03HZGTL

Active
Rohm Semiconductor

MOSFET, P-CH, 30V, 4A, SOT-346T ROHS COMPLIANT: YES

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RRR040P03HZGTL
Discrete Semiconductor Products

RRR040P03HZGTL

Active
Rohm Semiconductor

MOSFET, P-CH, 30V, 4A, SOT-346T ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRRR040P03HZGTL
Current - Continuous Drain (Id) @ 25°C4 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs10.5 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]1000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-96
Power Dissipation (Max) [Max]700 mW
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs45 mOhm
Supplier Device PackageTSMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 6181$ 0.70
NewarkEach 1$ 0.92
10$ 0.66
100$ 0.49
500$ 0.41
1000$ 0.35
2500$ 0.32
12000$ 0.28

Description

General part information

RRR040P03HZG Series

RRR040P03HZG is a MOSFET for switching applications. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Taping Information

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

RRR040P03HZG ESD Data

Characteristics Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Inner Structure

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation - Transistors

Package Information

How to Create Symbols for PSpice Models

Models

Types and Features of Transistors

Application Note

Part Explanation

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

Compliance of the RoHS directive

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Explanation for Marking

Package Information