Integrated Circuits (ICs)

LPV324MT

Obsolete

Texas Instruments

IC OPAMP GP 4 CIRCUIT 14TSSOP

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Integrated Circuits (ICs)

LPV324MT

Obsolete

Texas Instruments

IC OPAMP GP 4 CIRCUIT 14TSSOP

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	LPV324MT

Amplifier Type	General Purpose
Current - Input Bias	2 nA
Current - Output / Channel	16 mA
Current - Supply	28 µA
Gain Bandwidth Product	152 kHz
Mounting Type	Surface Mount
Number of Circuits	4
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Output Type	Rail-to-Rail
Package / Case	14-TSSOP
Package / Case [custom]	0.173 "
Package / Case [custom]	4.4 mm
Slew Rate	0.1 V/µs
Supplier Device Package	14-TSSOP
Voltage - Input Offset	1.5 mV
Voltage - Supply Span (Max) [Max]	5 V
Voltage - Supply Span (Min) [Min]	2.7 V

LPV324-N Series

Quad, 5-V, 152-kHz, low quiescent current (7.5-μA), RRO operational amplifier

Part	Gain Bandwidth Product	Voltage - Supply Span (Min) [Min]	Current - Supply	Mounting Type	Voltage - Input Offset	Current - Input Bias	Current - Output / Channel	Supplier Device Package	Voltage - Supply Span (Max) [Max]	Number of Circuits	Slew Rate	Operating Temperature [Max]	Operating Temperature [Min]	Amplifier Type	Output Type	Package / Case [custom]	Package / Case [custom]	Package / Case	Package / Case [x]	Package / Case [y]
Texas Instruments LPV324IPWRG4	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA	14-TSSOP	5 V	4	0.1 V/µs	125 °C	-40 °C	General Purpose	Rail-to-Rail	0.173 "	4.4 mm	14-TSSOP
Texas Instruments LPV324IPWE4	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA	14-TSSOP	5 V	4	0.1 V/µs	125 °C	-40 °C	General Purpose	Rail-to-Rail	0.173 "	4.4 mm	14-TSSOP
Texas Instruments LPV324PWG4	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA	14-TSSOP	5 V	4	0.1 V/µs	85 °C	-40 °C	General Purpose	Rail-to-Rail	0.173 "	4.4 mm	14-TSSOP
Texas Instruments LPV324D	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA		5 V	4	0.1 V/µs	85 °C	-40 °C	General Purpose	Rail-to-Rail			14-SOIC	0.154 in	3.9 mm
Texas Instruments LPV324PWRE4	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA	14-TSSOP	5 V	4	0.1 V/µs	85 °C	-40 °C	General Purpose	Rail-to-Rail	0.173 "	4.4 mm	14-TSSOP
Texas Instruments LPV324MT	152 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	16 mA	14-TSSOP	5 V	4	0.1 V/µs	85 °C	-40 °C	General Purpose	Rail-to-Rail	0.173 "	4.4 mm	14-TSSOP
Texas Instruments LPV324DR	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA		5 V	4	0.1 V/µs	85 °C	-40 °C	General Purpose	Rail-to-Rail			14-SOIC	0.154 in	3.9 mm
Texas Instruments LPV324M	152 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	16 mA		5 V	4	0.1 V/µs	85 °C	-40 °C	General Purpose	Rail-to-Rail			14-SOIC	0.154 in	3.9 mm
Texas Instruments LPV324PWR	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA	14-TSSOP	5 V	4	0.1 V/µs	85 °C	-40 °C	General Purpose	Rail-to-Rail	0.173 "	4.4 mm	14-TSSOP
Texas Instruments LPV324IDE4	237 kHz	2.7 V	28 µA	Surface Mount	1.5 mV	2 nA	72 mA		5 V	4	0.1 V/µs	125 °C	-40 °C	General Purpose	Rail-to-Rail			14-SOIC	0.154 in	3.9 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

LPV324-N Series

The LPV3xx-N are low power (9-µA per channel at 5 V) versions of the LMV3xx op amps. This is another addition to the LMV family of commodity op amps.

The LPV3xx-N are the most cost effective solutions for the applications where low voltage, low power operation, space saving and low price are needed. The LPV3xx-N have rail-to-rail output swing capability and the input common-mode voltage range includes ground. They all exhibit excellent speed-power ratio, achieving 152 kHz of bandwidth with a supply current of only 9 µA.

The LPV321-N is available in space saving 5-Pin SC70, which is approximately half the size of 5-Pin SOT-23. The small package saves space on PC boards, and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.

Documents

Technical documentation and resources