Connectors, Interconnects

1-1437542-0

Obsolete

CONN IC DIP SOCKET 8POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Obsolete

CONN IC DIP SOCKET 8POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	1-1437542-0

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	20 µin
Contact Finish Thickness - Post	0.51 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	10 mOhm
Current Rating (Amps)	3 A
Features	Carrier, Closed Frame
Housing Material	Aluminum Alloy
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	8
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	4
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	7.62 mm
Type	0.3 in
Type	DIP

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Resistance	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Features	Mounting Type	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Type	Type	Type	Contact Material - Post	Contact Finish - Post	Housing Material	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]
TE Connectivity AMP Connectors 2-1437542-2	0.125 in	3.18 mm	3 A	10 mOhm	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	-55 C	125 °C	18	20 µin	0.51 µm	0.1 in	2.54 mm	Carrier Closed Frame	Right Angle Through Hole Vertical	Gold	0.51 µm	20 µin	Solder	7.62 mm	0.3 in	DIP	Beryllium Copper	Gold	Aluminum Alloy
TE Connectivity AMP Connectors 2-1437542-9	0.125 in	3.18 mm	3 A	10 mOhm	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	-55 C	125 °C	20	20 µin	0.51 µm	0.1 in	2.54 mm	Carrier Closed Frame	Through Hole	Gold	0.51 µm	20 µin	Solder	7.62 mm	0.3 in	DIP	Beryllium Copper	Gold	Aluminum Alloy
TE Connectivity AMP Connectors 1-1437542-0	0.125 in	3.18 mm	3 A	10 mOhm	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	-55 C	125 °C	8	20 µin	0.51 µm	0.1 in	2.54 mm	Carrier Closed Frame	Through Hole	Gold	0.51 µm	20 µin	Solder	7.62 mm	0.3 in	DIP	Beryllium Copper	Gold	Aluminum Alloy	2	4

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 2.04

General part information

8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources