Integrated Circuits (ICs)

ZSSC3281BI5B

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SIGNAL CONDITIONING DICE ON 304 MICRO METER WAFER WITH INKIN

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Integrated Circuits (ICs)

Active

SIGNAL CONDITIONING DICE ON 304 MICRO METER WAFER WITH INKIN

Technical Specifications

Parameters and characteristics for this part

Part	Output Type	Input Type	Mounting Type	Current - Supply	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Package / Case	Type
Renesas Electronics Corporation ZSSC3281BI5B	1-Wire® I2C SPI	Analog Digital	Surface Mount	15 mA	125 °C	-40 °C	Die	Die	Signal Conditioner
Renesas Electronics Corporation ZSSC3281BC2B	1-Wire® I2C SPI	Analog Digital	Surface Mount	15 mA	125 °C	-40 °C	Die	Die	Signal Conditioner

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 3.17
	Tray	2090	$ 3.61
Mouser	N/A	2090	$ 3.17

General part information

SIGNAL CONDITIONING DICE ON 304 MICRO METER WAFER WITH INKIN

Technical documentation and resources