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B0QFN (RDB)
Power Supplies - Board Mount

TPSM5D1806RDBR

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Texas Instruments

4.5-V TO 15-V INPUT, DUAL 6-A, SINGLE 12-A, OUTPUT POWER MODULE

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B0QFN (RDB)
Power Supplies - Board Mount

TPSM5D1806RDBR

Active
Texas Instruments

4.5-V TO 15-V INPUT, DUAL 6-A, SINGLE 12-A, OUTPUT POWER MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationTPSM5D1806RDBR
ApplicationsITE (Commercial)
Current - Output (Max) [Max]12 A
FeaturesRemote On/Off, Adjustable Output, Remote Sense
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case51-PowerFQFN Module
Size / Dimension [x]8 mm
Size / Dimension [x]0.31 "
Size / Dimension [y]5.5 mm
Size / Dimension [y]0.22 "
Size / Dimension [z]0.07 "
Size / Dimension [z]1.9 mm
Supplier Device Package51-BQFN
Supplier Device Package [x]8
Supplier Device Package [y]5.5
TypeNon-Isolated PoL Module
Voltage - Input (Max) [Max]15 V
Voltage - Input (Min) [Min]4.5 V
Voltage - Output 1 [Max]5.5 V
Voltage - Output 1 [Min]0.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 26.64
10$ 19.73
25$ 17.96
100$ 15.98
250$ 15.03
500$ 15.00
Digi-Reel® 1$ 26.64
10$ 19.73
25$ 17.96
100$ 15.98
250$ 15.03
500$ 15.00
Tape & Reel (TR) 2000$ 15.00
Texas InstrumentsLARGE T&R 1$ 19.92
100$ 17.40
250$ 13.42
1000$ 12.00

Description

General part information

TPSM5D1806 Series

The TPSM5D1806 dual 6-A output power module is a highly integrated and flexible DC-DC power supply packaged in a compact 8-mm × 5.5-mm × 1.8-mm, QFN package. The input voltage range of 4.5 V to 15 V allows conversion from a wide intermediate bus as well as standard 5-V and 12-V rails. The two 6-A outputs can be configured independently for two separate power rails or combined for a single 2-phase, 12-A output.

The low-profile, 51-pin QFN package with optimal package layout enhances thermal performance. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device for simple layout and easy handling in manufacturing.

The integrated power design eliminates the loop compensation and magnetics part selection from the design process. The device offers independent enable control and power good signal for each output. Switching frequency and phase offsetting can be configured using pin-strapping. The device also offers overcurrent and thermal shutdown protection.