Technical Specifications
Parameters and characteristics for this part
| Specification | BSC110N15NS5SCATMA1 |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 76 A |
| Drain to Source Voltage (Vdss) | 150 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V, 8 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs [Max] | 35 nC |
| Input Capacitance (Ciss) (Max) @ Vds [Max] | 2770 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 8-PowerTDFN |
| Power Dissipation (Max) | 125 W |
| Rds On (Max) @ Id, Vgs | 11 mOhm |
| Supplier Device Package | PG-TDSON-8-7 |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 4.6 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 4.62 | |
| 10 | $ 3.06 | |||
| 100 | $ 2.17 | |||
| 500 | $ 1.79 | |||
| 1000 | $ 1.70 | |||
| Digi-Reel® | 1 | $ 4.62 | ||
| 10 | $ 3.06 | |||
| 100 | $ 2.17 | |||
| 500 | $ 1.79 | |||
| 1000 | $ 1.70 | |||
| N/A | 5671 | $ 4.44 | ||
| Tape & Reel (TR) | 4000 | $ 1.70 | ||
| Mouser | N/A | 1 | $ 4.22 | |
| 10 | $ 3.03 | |||
| 100 | $ 2.15 | |||
| 500 | $ 1.78 | |||
| 1000 | $ 1.69 | |||
| 4000 | $ 1.68 | |||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 4.42 | |
| 10 | $ 3.10 | |||
| 25 | $ 2.91 | |||
| 50 | $ 2.58 | |||
| 100 | $ 2.25 | |||
| 250 | $ 2.20 | |||
| 500 | $ 1.86 | |||
| 1000 | $ 1.78 | |||
Description
General part information
BSC110N15 Series
OptiMOS™ 5 power MOSFETs 150 VinSuperSO8 DSC (dual-side cooling)package offer all thermal management benefits of dual-side cooling solutions with industry-standard footprint. SuperSO8 DSC allows excellent thermal performance with two paths for heat dissipation (bottom through PCB + top through exposed clip and heatsink). About 30% of the heat generated on the MOSFET die is transferred through the top and less heat is transferred to the PCB. Thus,
Documents
Technical documentation and resources
