Zenode.ai Logo
Beta
ISL8204M_ISL8206M Functional Diagram
Power Supplies - Board Mount

ISL8206MIRZ-T

Obsolete
Renesas Electronics Corporation

COMPLETE HIGH EFFICIENCY DC/DC POWER MODULE

Deep-Dive with AI

Search across all available documentation for this part.

ISL8204M_ISL8206M Functional Diagram
Power Supplies - Board Mount

ISL8206MIRZ-T

Obsolete
Renesas Electronics Corporation

COMPLETE HIGH EFFICIENCY DC/DC POWER MODULE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationISL8206MIRZ-T
ApplicationsITE (Commercial)
Current - Output (Max) [Max]6 A
Efficiency95 %
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case15-PowerBQFN Module
Size / Dimension [x]15 mm
Size / Dimension [x]0.59 in
Size / Dimension [y]15 mm
Size / Dimension [y]0.59 in
Size / Dimension [z]0.14 "
Size / Dimension [z]3.5 mm
Supplier Device Package15-QFN (15x15)
TypeNon-Isolated PoL Module
Voltage - Input (Max) [Max]20 V
Voltage - Input (Min) [Min]1 V
Voltage - Output 1 [Max]6 V
Voltage - Output 1 [Min]0.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

ISL8206M Series

The ISL8204M, ISL8206M is a family of pin-compatible power modules to the ISL8201M. These are simple and easy to use, high power DC/DC modules and are ideal for a wide variety of applications. The ISL820xM family of high current DC/DC step-down modules virtually eliminate design and manufacturing risks while dramatically improving time to market. The simplicity is in the family's Off The Shelf unassisted implementation. All you need is the ISL820xM for the current requirement of your design, bulk input and output capacitors and one resistor, to program the output voltage, and you have a complete high current power design ready for your market. This family of buck converters is packaged in a thermally enhanced compact (15mmx15mm) overmolded QFN Package that operates without a heatsink, even at full load over temperature. The package supports simple, reliable, automated assembly using standard surface mount equipment while making it easy to probe to all pins. The lack of a required heat dissipation layer, provides easy access to all pins and the limited number of the external components reduce the PCB to a component layer and a simple ground layer. Additionally, each IC in the family is footprint compatible, making it easy to change your design to meet different power needs without changing your layout. One simple layout fits all.

Documents

Technical documentation and resources