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Discrete Semiconductor Products

RGTH60TK65DGC11

NRND
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 30A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

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Product dimension image
Discrete Semiconductor Products

RGTH60TK65DGC11

NRND
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 30A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTH60TK65DGC11
Current - Collector (Ic) (Max) [Max]28 A
Current - Collector Pulsed (Icm)120 A
Gate Charge58 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-3PFM, SC-93-3
Power - Max [Max]61 W
Reverse Recovery Time (trr)58 ns
Supplier Device PackageTO-3PFM
Td (on/off) @ 25°C [custom]27 ns
Td (on/off) @ 25°C [custom]105 ns
Test Condition30 A, 10 Ohm, 15 V, 400 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 403$ 3.72
NewarkEach 1$ 3.49
10$ 3.23
25$ 3.03

Description

General part information

RGTH60TK65D Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Inner Structure

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

What is a Thermal Model? (IGBT)

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation

Package Information

Compliance of the ELV directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What Is Thermal Design

Thermal Design

RGTH60TK65D Data Sheet

Data Sheet

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Condition of Soldering

Package Information

Part Explanation

Application Note

Types and Features of Transistors

Application Note

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

About Export Administration Regulations (EAR)

Export Information

How to Create Symbols for PSpice Models

Models

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Package Dimensions

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper