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RUC002N05T116
Discrete Semiconductor Products

BC846BHZGT116

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Rohm Semiconductor

NPN, SOT-23, 65V 120MA, GENERAL PURPOSE TRANSISTOR FOR AUTOMOTIVE

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RUC002N05T116
Discrete Semiconductor Products

BC846BHZGT116

Active
Rohm Semiconductor

NPN, SOT-23, 65V 120MA, GENERAL PURPOSE TRANSISTOR FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationBC846BHZGT116
Current - Collector (Ic) (Max) [Max]120 mA
Current - Collector Cutoff (Max) [Max]15 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]200
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
QualificationAEC-Q101
Supplier Device PackageSST3
Vce Saturation (Max) @ Ib, Ic400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]65 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.32
10$ 0.20
100$ 0.12
500$ 0.09
1000$ 0.08
Digi-Reel® 1$ 0.32
10$ 0.20
100$ 0.12
500$ 0.09
1000$ 0.08
N/A 1124$ 0.32
Tape & Reel (TR) 3000$ 0.07
6000$ 0.06
9000$ 0.06
15000$ 0.05
21000$ 0.05
30000$ 0.05
75000$ 0.04
150000$ 0.04
NewarkEach (Supplied on Full Reel) 3000$ 0.07
6000$ 0.06
12000$ 0.06
18000$ 0.05
30000$ 0.05

Description

General part information

BC846BHZG Series

BC846BHZG is the BVCEO>65V transistor for audio frequency small signal amplifier

Documents

Technical documentation and resources

Two-Resistor Model for Thermal Simulation

Thermal Design

Reliability Test Result

Manufacturing Data

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Export Regulations

Export Information

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Transistors

Package Information

BC846BHZG Data Sheet

Data Sheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design