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UMD3
Circuit Protection

UMZC6.8NT106

Active
Rohm Semiconductor

ESD PROTRECTION DIODE, 0.2W, SOT-323

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UMD3
Circuit Protection

UMZC6.8NT106

Active
Rohm Semiconductor

ESD PROTRECTION DIODE, 0.2W, SOT-323

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationUMZC6.8NT106
ApplicationsGeneral Purpose
Mounting TypeSurface Mount
Package / CaseSOT-323, SC-70
Power Line ProtectionFalse
Supplier Device PackageUMD3
TypeZener
Unidirectional Channels2
Voltage - Breakdown (Min) [Min]6.47 V
Voltage - Reverse Standoff (Typ)3.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.50
10$ 0.31
100$ 0.20
500$ 0.15
1000$ 0.13
Digi-Reel® 1$ 0.50
10$ 0.31
100$ 0.20
500$ 0.15
1000$ 0.13
N/A 4870$ 0.37
Tape & Reel (TR) 3000$ 0.11
6000$ 0.10
9000$ 0.10
15000$ 0.09
21000$ 0.09
30000$ 0.08
75000$ 0.08
NewarkEach (Supplied on Cut Tape) 1$ 0.43
10$ 0.30
25$ 0.28
50$ 0.25
100$ 0.22
250$ 0.20
500$ 0.18
1000$ 0.17

Description

General part information

UMZC6.8 Series

ROHM's zener diodes are available in various lineup as 2-pin mold surface mount type and complex type.

Documents

Technical documentation and resources

UMD3 Part Marking

Related Document

Diode Flammability

Related Document

UMD3 T106 Taping Spec

Datasheet

Technical Data Sheet EN

Datasheet

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

What Is Thermal Design

Thermal Design

Compliance of the RoHS directive

Environmental Data

What Are TVS Diodes?

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Part Explanation

Application Note

List of Diode Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Differences between TVS and Zener Diodes

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Package Dimensions

Package Information

Diode Types and Applications

Technical Article

ESD Data

Characteristics Data

PCB Layout for TVS Diodes

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Inner Structure

Package Information

Low-Side Current Sensing Circuit Design

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Selection Method and Usage of TVS Diodes

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Constitution Materials List

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification