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Technical Specifications
Parameters and characteristics for this part
| Specification | ESQT-121-02-G-D-560 |
|---|---|
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.51 µm |
| Contact Finish Thickness - Mating | 20 µin |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Post [x] | 0.29 " |
| Contact Length - Post [x] | 7.37 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.56 in |
| Insulation Height | 14.22 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 42 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
| Part | Contact Finish - Mating | Contact Finish - Post | Pitch - Mating [x] | Pitch - Mating [x] | Termination | Row Spacing - Mating | Row Spacing - Mating | Contact Type | Operating Temperature [Min] | Operating Temperature [Max] | Number of Rows | Contact Material | Fastening Type | Material Flammability Rating | Insulation Color | Insulation Material | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Height | Insulation Height | Contact Shape | Number of Positions | Mounting Type | Connector Type | Contact Length - Post | Contact Length - Post | Number of Positions Loaded | Style | Contact Length - Post [x] | Contact Length - Post [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 3 µin | 0.076 µm | 17.02 mm | 0.67 " | Square | 42 | Through Hole | Elevated Socket | 0.18 in | 4.57 mm | All | Board to Board Cable | ||||
Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 10 çin | 0.25 çm | 18.42 mm | 0.725 " | Square | 42 | Through Hole | Elevated Socket | All | Board to Board Cable | 3.18 mm | 0.125 in | ||||
Samtec Inc. | Gold | Gold | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 3 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 20 µin | 0.51 µm | 18.03 mm | 0.71 " | Square | 63 | Through Hole | Elevated Socket | All | Board to Board Cable | 3.56 mm | 0.14 in | 3 µin | 0.076 µm | ||
Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 3 µin | 0.076 µm | 18.54 mm | 0.73 " | Square | 84 | Through Hole | Elevated Socket | All | Board to Board Cable | 3.05 mm | 0.12 in | |||||
Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 10 çin | 0.25 çm | 15.15 mm | 0.596 in | Square | 42 | Through Hole | Elevated Socket | 0.254 in | 6.45 mm | All | Board to Board Cable | ||||
Samtec Inc. | Gold | Gold | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 20 µin | 0.51 µm | 14.22 mm | 0.56 in | Square | 42 | Through Hole | Elevated Socket | All | Board to Board Cable | 7.37 mm | 0.29 " | 3 µin | 0.076 µm | ||
Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 3 µin | 0.076 µm | 12.7 mm | 0.5 in | Square | 42 | Through Hole | Elevated Socket | All | Board to Board Cable | 8.89 mm | 0.35 in | ||||
 Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 20 µin | 0.51 µm | 8 mm | 0.315 in | Square | 42 | Through Hole | Elevated Socket | All | Board to Board Cable | 3.63 mm | 0.143 in | ||||
Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 10 çin | 0.25 çm | 12.44 mm | 0.49 in | Square | 42 | Through Hole | Elevated Socket | 0.36 in | 9.14 mm | All | Board to Board Cable | ||||
Samtec Inc. | Gold | Tin | 0.079 in | 2 mm | Solder | 0.079 in | 2 mm | Forked | -55 °C | 125 °C | 2 | Phosphor Bronze | Push-Pull | UL94 V-0 | Black | Liquid Crystal Polymer (LCP) | 4.5 A | 3 µin | 0.076 µm | 10.36 mm | 0.408 in | Square | 42 | Through Hole | Elevated Socket | 0.05 in | 1.27 mm | All | Board to Board Cable |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 13 | $ 18.05 | |
Description
General part information
ESQT-121 Series
42 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Documents
Technical documentation and resources
No documents available