Zenode.ai Logo
Beta
Product dimension image
Discrete Semiconductor Products

RGWSX2TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 60A, FRD BUILT-IN, TO-247GE, FIELD STOP TRENCH IGBT

Deep-Dive with AI

Search across all available documentation for this part.

Product dimension image
Discrete Semiconductor Products

RGWSX2TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 60A, FRD BUILT-IN, TO-247GE, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGWSX2TS65DGC13
Current - Collector (Ic) (Max) [Max]104 A
Current - Collector Pulsed (Icm)180 A
Gate Charge140 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]288 W
Reverse Recovery Time (trr)88 ns
Supplier Device PackageTO-247G
Switching Energy1.2 mJ, 1.43 mJ
Td (on/off) @ 25°C180 ns, 55 ns
Test Condition10 Ohm, 15 V, 400 V, 60 A
Vce(on) (Max) @ Vge, Ic2 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 595$ 7.63
MouserN/A 1$ 8.04
25$ 4.67
100$ 3.93
250$ 3.46
1200$ 3.45

Description

General part information

RGWSX2TS65D Series

RGWSX2TS65D is a IGBT with low collector - emitter saturation voltage, suitable for PFC, Solar converters, Mid to high switching frequency converters. The RGWS series features high-speed switching, contributing to higher efficiency of applications.

Documents

Technical documentation and resources

RGWSX2TS65DGC13 Datasheet (PDF)

Datasheet

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions - TO-247GE

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level

Package Information

Part Explanation

Application Note

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Compliance of the ELV directive

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Administration Regulations (EAR)

Export Information

What Is Thermal Design

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

About Flammability of Materials

Environmental Data

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

What is a Thermal Model? (IGBT)

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Types and Features of Transistors

Application Note

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Anti-Whisker formation

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification