
Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | OPA541AP |
|---|---|
| Amplifier Type | Power |
| Current - Input Bias | 4 pA |
| Current - Output / Channel | 10 A |
| Gain Bandwidth Product | 1.6 MHz |
| Mounting Type | Through Hole |
| Number of Circuits | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -25 °C |
| Package / Case | TO-220-11 (Formed Leads) |
| Slew Rate | 10 V/çs |
| Supplier Device Package | TO-220-11 |
| Voltage - Input Offset | 2 mV |
| Voltage - Supply Span (Max) [Max] | 70 V |
| Voltage - Supply Span (Min) [Min] | 20 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 27.42 | |
| 10 | $ 20.35 | |||
| 25 | $ 18.54 | |||
| 100 | $ 16.51 | |||
| 250 | $ 15.55 | |||
| Newark | Each | 1 | $ 46.34 | |
| 5 | $ 45.20 | |||
| 10 | $ 44.11 | |||
| 25 | $ 43.14 | |||
| 50 | $ 42.26 | |||
| 100 | $ 41.74 | |||
| 250 | $ 41.27 | |||
| Texas Instruments | TUBE | 1 | $ 20.65 | |
| 100 | $ 18.04 | |||
| 250 | $ 13.91 | |||
| 1000 | $ 12.44 | |||
Description
General part information
OPA541 Series
The OPA541 device is a power-operational amplifier capable of operation from power supplies up to ±40 V, and delivering continuous output currents up to 5 A. Internal current-limit circuitry can be user-programmed with a single external resistor, protecting the amplifier and load from fault conditions. The OPA541 devices fabricated are using a proprietary bipolar and FET process.
The OPA541 uses a single current-limit resistor to set both the positive and negative current limits. Applications currently using hybrid power amplifiers requiring two current-limit resistors do need not to be modified.
The OPA541 is available in an 11-pin power plastic package and an industry-standard 8-pin TO-3 hermetic package. The power plastic pachage has a copper-lead frame to maximize heat transfer. The TO-3 package is isolated from all circuitry, allowing it to be mounted directly to a heat sink without special insulators.
Documents
Technical documentation and resources