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Discrete Semiconductor Products

RCX100N25

Active
Rohm Semiconductor

POWER FIELD-EFFECT TRANSISTOR, 10A I(D), 250V, 0.32OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TO-220AB, TO-220FM, 3 PIN

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Product dimension image
Discrete Semiconductor Products

RCX100N25

Active
Rohm Semiconductor

POWER FIELD-EFFECT TRANSISTOR, 10A I(D), 250V, 0.32OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TO-220AB, TO-220FM, 3 PIN

Technical Specifications

Parameters and characteristics for this part

SpecificationRCX100N25
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)250 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max)40 W
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 1.52
10$ 1.26
100$ 1.00
500$ 0.91

Description

General part information

RCX100N25 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Export Regulations

Export Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Types and Features of Transistors

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Inner Structure

Package Information

What Is Thermal Design

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

What is a Thermal Model? (Transistor)

Thermal Design

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Explanation for Marking

Package Information

RCX100N25 Data Sheet

Data Sheet