Integrated Circuits (ICs)

R7F7017113ABG-C#AC1

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IC MCU 32BIT 8MB FLASH 223FBGA

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Integrated Circuits (ICs)

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IC MCU 32BIT 8MB FLASH 223FBGA

Technical Specifications

Parameters and characteristics for this part

Specification	R7F7017113ABG-C#AC1

Connectivity	I2C, CANbus, LINbus, UART/USART, CSI, SENT, FlexRay, FIFO
Core Processor	RH850G3KH
Core Size	32 Bit
Core Size	Dual-Core
Data Converters	32x12b, A/D 38x10b
EEPROM Size	256 K
Mounting Type	Surface Mount
Number of I/O	174
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	233-FBGA
Peripherals	LVD, WDT, DMA, PWM
Program Memory Size	8 MB
Program Memory Type	FLASH
RAM Size	1.03 M
Speed	240 MHz
Supplier Device Package	233-FBGA
Supplier Device Package [x]	15
Supplier Device Package [y]	15
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

Part	Program Memory Size	Speed	Program Memory Type	Supplier Device Package	Supplier Device Package [x]	Supplier Device Package [y]	Data Converters	Operating Temperature [Min]	Operating Temperature [Max]	EEPROM Size	RAM Size	Package / Case	Peripherals	Core Size	Core Size	Core Processor	Mounting Type	Oscillator Type	Connectivity	Number of I/O	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]
Renesas Electronics Corporation R7F7017113ABG-C#AC1	8 MB	240 MHz	FLASH	233-FBGA	15	15	32x12b A/D 38x10b	-40 °C	105 °C	256 K	1.03 M	233-FBGA	DMA LVD PWM WDT	32 Bit	Dual-Core	RH850G3KH	Surface Mount	Internal	CANbus CSI FIFO FlexRay I2C LINbus SENT UART/USART	174	5.5 V	3 V

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3KH RH850/F1x Microcontroller IC 32-Bit Dual-Core 240MHz 8MB (8M x 8) FLASH 233-FBGA (15x15)

Technical documentation and resources