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Discrete Semiconductor Products

UMB11NTN

Active
Rohm Semiconductor

PNP+PNP, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Product schematic image
Discrete Semiconductor Products

UMB11NTN

Active
Rohm Semiconductor

PNP+PNP, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationUMB11NTN
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]500 nA
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / CaseSOT-363, SC-88, 6-TSSOP
Resistor - Emitter Base (R2)10 kOhms
Supplier Device PackageUMT6
Transistor Type2 PNP - Pre-Biased (Dual)
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.46
10$ 0.33
100$ 0.16
500$ 0.15
1000$ 0.11
Digi-Reel® 1$ 0.46
10$ 0.33
100$ 0.16
500$ 0.15
1000$ 0.11
Tape & Reel (TR) 3000$ 0.07
6000$ 0.07

Description

General part information

UMB11 Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Inner Structure

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

Taping Information

Package Information

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

UMB11N Data Sheet

Data Sheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Explanation for Marking

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Types and Features of Transistors

Application Note

Reliability Test Result

Manufacturing Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models