Discrete Semiconductor Products

SIGC156T60NR2CX7SA1

Obsolete

IGBT 3 CHIP 600V WAFER

Search across all available documentation for this part.

Discrete Semiconductor Products

Obsolete

IGBT 3 CHIP 600V WAFER

Technical Specifications

Parameters and characteristics for this part

Specification	SIGC156T60NR2CX7SA1

Current - Collector (Ic) (Max) [Max]	200 A
Current - Collector Pulsed (Icm)	600 A
IGBT Type	NPT
Mounting Type	Surface Mount
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Package / Case	Die
Supplier Device Package	Die
Td (on/off) @ 25°C [custom]	180 ns
Td (on/off) @ 25°C [custom]	285 ns
Test Condition	1.5 Ohm, 200 A, 300 V, 15 V
Vce(on) (Max) @ Vge, Ic	2.5 V
Voltage - Collector Emitter Breakdown (Max) [Max]	600 V

Part	Vce(on) (Max) @ Vge, Ic	IGBT Type	Current - Collector (Ic) (Max) [Max]	Td (on/off) @ 25°C [custom]	Td (on/off) @ 25°C [custom]	Package / Case	Voltage - Collector Emitter Breakdown (Max) [Max]	Test Condition	Operating Temperature [Max]	Operating Temperature [Min]	Current - Collector Pulsed (Icm)	Mounting Type	Supplier Device Package
INFINEON SIGC156T60NR2CX1SA2	2.5 V	NPT	200 A	180 ns	285 ns	Die	600 V	1.5 Ohm 15 V 200 A 300 V	150 °C	-55 °C	600 A	Surface Mount	Die
INFINEON SIGC156T60NR2CX1SA4	2.5 V	NPT	200 A	180 ns	285 ns	Die	600 V	1.5 Ohm 15 V 200 A 300 V	150 °C	-55 °C	600 A	Surface Mount	Die
INFINEON SIGC156T60NR2CX7SA1	2.5 V	NPT	200 A	180 ns	285 ns	Die	600 V	1.5 Ohm 15 V 200 A 300 V	150 °C	-55 °C	600 A	Surface Mount	Die

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

General part information

IGBT NPT 600 V 200 A Surface Mount Die

Technical documentation and resources