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Littelfuse Power Semi TO-247 3 H 2Sq 1W2N 3L image
Discrete Semiconductor Products

IXFH56N30X3

Active
Littelfuse/Commercial Vehicle Products

POWER MOSFET, N CHANNEL, 300 V, 56 A, 0.021 OHM, TO-247, THROUGH HOLE

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Littelfuse Power Semi TO-247 3 H 2Sq 1W2N 3L image
Discrete Semiconductor Products

IXFH56N30X3

Active
Littelfuse/Commercial Vehicle Products

POWER MOSFET, N CHANNEL, 300 V, 56 A, 0.021 OHM, TO-247, THROUGH HOLE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationIXFH56N30X3
Current - Continuous Drain (Id) @ 25°C56 A
Drain to Source Voltage (Vdss)300 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs56 nC
Input Capacitance (Ciss) (Max) @ Vds3750 pF
Mounting TypeThrough Hole
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseTO-247-3
Power Dissipation (Max) [Max]320 W
Rds On (Max) @ Id, Vgs27 mOhm
Supplier Device PackageTO-247 (IXTH)
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.42
30$ 5.93
120$ 5.49

Description

General part information

IXFH56N30X3 Series

Developed using a charge compensation principle and proprietary process technology, these Ultra Junction MOSFETs provide the best-in-class Figure of Merit (on-resistance times gate charge), which translates into lowest conduction and switching losses. They exhibit the lowest on-state resistances in the industry. With low reverse recovery charge and time, the body diodes are capable of removing all the leftover energies during high-speed switching to avoid device failure and achieve high efficiency. Moreover, these new devices are avalanche capable and exhibit a superior dv/dt performance as well. They are robust against device failure caused by voltage spikes and accidental turn-on of parasitic bipolar transistors inherent in the MOSFET structure. As such these rugged devices require fewer snubbers and can be used in both hard and soft switching power converters.

Documents

Technical documentation and resources