Specification	M0G3507QPMRQ1

Connectivity	SmartCard, DALI, SMBus, LINbus, I2C, UART/USART, SPI, CANbus, IrDA
Core Processor	ARM® Cortex®-M0+
Core Size	32-Bit
Data Converters	D/A 1x12b, A/D 17x12b SAR
Grade	Automotive
Mounting Type	Surface Mount
Number of I/O	60
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	External, Internal
Package / Case	64-LQFP
Peripherals	DMA, PWM, Brown-out Detect/Reset, AES, POR, WDT
Program Memory Size	128 KB
Program Memory Type	FLASH
Qualification	AEC-Q100
Speed	80 MHz
Supplier Device Package	64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	1.62 V

MSPM0G3507-Q1 Series

Automotive 80MHz Arm® Cortex®-M0+ MCU with 128KB flash 32KB SRAM ADC, DAC, COMP, OPA, CAN-FD, MATHAC

Part	Mounting Type	Program Memory Type	Operating Temperature [Min]	Operating Temperature [Max]	Peripherals	Connectivity	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Core Processor	Program Memory Size	Qualification	Supplier Device Package	Number of I/O	Data Converters	Speed	Package / Case	Core Size	Grade	Oscillator Type
Texas Instruments M0G3507QPMRQ1	Surface Mount	FLASH	-40 °C	125 °C	AES Brown-out Detect/Reset DMA POR PWM WDT	CANbus DALI I2C IrDA LINbus SmartCard SMBus SPI UART/USART	3.6 V	1.62 V	ARM® Cortex®-M0+	128 KB	AEC-Q100	64-LQFP (10x10)	60	A/D 17x12b SAR D/A 1x12b	80 MHz	64-LQFP	32-Bit	Automotive	External Internal
Texas Instruments M0G3507QRHBRQ1	Surface Mount	FLASH	-40 °C	125 °C	AES Brown-out Detect/Reset DMA POR PWM WDT	CANbus DALI I2C IrDA LINbus SmartCard SMBus SPI UART/USART	3.6 V	1.62 V	ARM® Cortex®-M0+	128 KB	AEC-Q100	32-VQFN (5x5)	28	A/D 11x12b SAR D/A 1x12b	80 MHz	32-VFQFN Exposed Pad	32-Bit	Automotive	External Internal
Texas Instruments M0G3507QPTRQ1	Surface Mount	FLASH	-40 °C	125 °C	AES Brown-out Detect/Reset DMA POR PWM WDT	CANbus DALI I2C IrDA LINbus SmartCard SMBus SPI UART/USART	3.6 V	1.62 V	ARM® Cortex®-M0+	128 KB	AEC-Q100	48-LQFP (7x7)	44	A/D 16x12b SAR D/A 1x12b	80 MHz	48-LQFP	32-Bit	Automotive	External Internal
Texas Instruments M0G3507QRGZRQ1

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 2.80
		10	$ 2.52
		25	$ 2.37
		100	$ 2.02
		250	$ 1.90
		500	$ 1.66
	Digi-Reel®	1	$ 2.80
		10	$ 2.52
		25	$ 2.37
		100	$ 2.02
		250	$ 1.90
		500	$ 1.66
	Tape & Reel (TR)	1000	$ 1.38
		2000	$ 1.28
		5000	$ 1.23
Texas Instruments	LARGE T&R	1	$ 2.11
		100	$ 1.74
		250	$ 1.25
		1000	$ 0.94

Description

General part information

MSPM0G3507-Q1 Series

MSPM0G350x microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform operating at up to 80MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62V to 3.6V.

The MSPM0G350x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option. These MCUs also incorporate a memory protection unit, 7-channel DMA, math accelerator, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, configurable internal shared voltage reference, one 12-bit 1-Msps DAC, three high speed comparators with built-in reference DACs, two zero-drift zero-crossover op-amps with programmable gain, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, five general-purpose timers (with one 16-bit general-purpose timer for QEI interface, two 16-bit general-purpose timers for STANDBY mode, and one 32-bit general-purpose timer), two windowed-watchdog timers, and one RTC with alarm and calendar modes. These devices provide data integrity and encryption peripherals (AES, CRC, TRNG) and enhanced communication interfaces (four UART, two I2C, two SPI, and CAN 2.0/FD).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration that allow customers to find the MCU that meets project needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.