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ROHM RF101L4STFTE25
Discrete Semiconductor Products

RBR5L30BDDTE25

Active
Rohm Semiconductor

LOW VF, 30V, 5A, DO-214AC (SMA), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

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ROHM RF101L4STFTE25
Discrete Semiconductor Products

RBR5L30BDDTE25

Active
Rohm Semiconductor

LOW VF, 30V, 5A, DO-214AC (SMA), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRBR5L30BDDTE25
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr150 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseDO-214AC, SMA
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackagePMDS
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If [Max]490 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.83
10$ 0.52
100$ 0.34
500$ 0.27
Digi-Reel® 1$ 0.83
10$ 0.52
100$ 0.34
500$ 0.27
N/A 5621$ 0.72
Tape & Reel (TR) 1500$ 0.25

Description

General part information

RBR5L30 Series

RBR5L30BDD is the high reliability Automotive Schottky Barrier Diode, suitable for general rectification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Moisture Sensitivity Level - Diodes

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Taping Information

Package Information

About Flammability of Materials

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Explanation for Marking

Package Information

Compliance of the RoHS directive

Environmental Data

Package Dimensions

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Part Explanation

Application Note

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

Constitution Materials List

Environmental Data

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

Diode Types and Applications

Technical Article

How to Select Rectifier Diodes

Technical Article

Reliability Test Result

Manufacturing Data

Inner Structure

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design