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RGW40TS65GC13
Discrete Semiconductor Products

RGW40TS65GC13

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Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 20A, TO-247N, FIELD STOP TRENCH IGBT

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RGW40TS65GC13
Discrete Semiconductor Products

RGW40TS65GC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 20A, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGW40TS65GC13
Current - Collector (Ic) (Max) [Max]40 A
Current - Collector Pulsed (Icm)80 A
Gate Charge59 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]136 W
Supplier Device PackageTO-247GE
Switching Energy330 µJ, 300 µJ
Td (on/off) @ 25°C [custom]76 ns
Td (on/off) @ 25°C [custom]33 ns
Test Condition20 A, 10 Ohm, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 600$ 4.85
NewarkEach 1$ 3.91
10$ 3.28
25$ 3.10
50$ 2.88
100$ 2.65
250$ 2.51

Description

General part information

RGW40TS65 Series

The RGW40TS65 is a fast switching speed IGBT, suitable for PFC, solar inverter, UPS, welding and IH. The RGTV/RGW series is a highly efficient series that is optimized the trade-off relationship between conduction loss and switching speed. In addition, optimizing the internal design allowed to achieve smooth switching characteristics that decrease voltage overshoot. It contributes to reduce the number of parts required along with design load.

Documents

Technical documentation and resources

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

RGW40TS65 Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions - TO-247GE

Package Information

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Create Symbols for PSpice Models

Models

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

About Export Administration Regulations (EAR)

Export Information

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level

Package Information

Types and Features of Transistors

Application Note

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What is a Thermal Model? (IGBT)

Thermal Design

Anti-Whisker formation

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper