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RS6E122BGTB1
Discrete Semiconductor Products

RS6E122BGTB1

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Rohm Semiconductor

NCH 30V 155A, HSOP8, POWER MOSFET

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RS6E122BGTB1
Discrete Semiconductor Products

RS6E122BGTB1

Active
Rohm Semiconductor

NCH 30V 155A, HSOP8, POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRS6E122BGTB1
Current - Continuous Drain (Id) @ 25°C155 A, 120 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs50 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]3310 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)89 W, 3 W
Rds On (Max) @ Id, Vgs2.16 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2500$ 2.85

Description

General part information

RS6E122BG Series

RS6E122BG is a power MOSFET with low-on resistance and High power package, suitable for switching.

Documents

Technical documentation and resources

RS6E122BGTB1 | Datasheet

Datasheet

List of Transistor Package Thermal Resistance

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

RS6E122BG ESD Data

Characteristics Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

HSOP8(TB1) Dimension

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

HSOP8(TB1) Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

What Is Thermal Design

Thermal Design

Types and Features of Transistors

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

HSOP8 Cu CRIP Inner Structure

Package Information

Anti-Whisker formation - Transistors

Package Information

HSOP8(TB1) Taping Information

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Part Explanation

Application Note

Taping Information

Package Information