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24-DIP
Integrated Circuits (ICs)

SN74HC652NT

Obsolete
Texas Instruments

IC TXRX NON-INVERT 6V 24DIP

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Search across all available documentation for this part.

24-DIP
Integrated Circuits (ICs)

SN74HC652NT

Obsolete
Texas Instruments

IC TXRX NON-INVERT 6V 24DIP

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74HC652NT
Current - Output High, Low [custom]7.8 mA
Current - Output High, Low [custom]7.8 mA
Mounting TypeThrough Hole
Number of Bits per Element8
Number of Elements1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type3-State
Package / Case0.3 in
Package / Case24-DIP
Package / Case7.62 mm
Supplier Device Package24-PDIP
Voltage - Supply [Max]6 V
Voltage - Supply [Min]2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

SN74HC652 Series

The ’HC652 devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Output-enable (OEAB and OEBA\) inputs are provided to control the transceiver functions. Select-control (SAB and SBA) inputs are provided to select real-time or stored data transfer. A low input level selects real-time data, and a high input level selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with these devices.

Data on the A or B data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) terminals, regardless of the select- or output-control terminals. When SAB and SBA are in the real-time transfer mode, it is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and OEBA\. In this configuration, each output reinforces its input. When all other data sources to the two sets of bus lines are at high impedance, each set of bus lines remains at its last state.

To ensure the high-impedance state during power up or power down, OEBA\ should be tied to VCCthrough a pullup resistor, and OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

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