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RFNL10BGE6STL
Discrete Semiconductor Products

RFNL10BGE6STL

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Rohm Semiconductor

600V 10A, TO-252, SINGLE SUPER FAST RECOVERY DIODE

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RFNL10BGE6STL
Discrete Semiconductor Products

RFNL10BGE6STL

Active
Rohm Semiconductor

600V 10A, TO-252, SINGLE SUPER FAST RECOVERY DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRFNL10BGE6STL
Current - Average Rectified (Io)10 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)150 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-252GE
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]1.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 2.43
MouserN/A 1$ 2.34
10$ 1.55
100$ 1.07
500$ 0.85
1000$ 0.78
2500$ 0.70
5000$ 0.69

Description

General part information

RFNL10BGE6S Series

RFNL10BGE6S is the silicon epitaxial planar type Fast Recovery Diode with ultra low forward voltage and low switching loss, suitable for general rectification or PFC (DCM : Discontinuous Current Mode).

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Diode Types and Applications

Technical Article

About Flammability of Materials

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

How to Select Rectifier Diodes

Technical Article

RFNL10BGE6S ESD Data

Characteristics Data

How to Use LTspice&reg; Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Compliance of the RoHS directive

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

RFNL10BGE6S Data Sheet

Data Sheet

Part Explanation

Application Note

Anti-Whisker formation - Diodes

Package Information

List of Diode Package Thermal Resistance

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design