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LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RD3P200SNTL1

Active
Rohm Semiconductor

NCH 100V 20A, TO-252 (DPAK), POWER MOSFET

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LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RD3P200SNTL1

Active
Rohm Semiconductor

NCH 100V 20A, TO-252 (DPAK), POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3P200SNTL1
Current - Continuous Drain (Id) @ 25°C20 A
Drain to Source Voltage (Vdss)100 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]55 nC
Input Capacitance (Ciss) (Max) @ Vds2100 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)20 W
Rds On (Max) @ Id, Vgs46 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5615$ 2.14
NewarkEach (Supplied on Cut Tape) 1$ 2.14
10$ 1.68
25$ 1.53
50$ 1.36
100$ 1.21
250$ 1.09
500$ 0.99
1000$ 0.92

Description

General part information

RD3P200SN Series

RD3P200SN is a Power MOSFET with Low on - resistance., suitable for Switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

What Is Thermal Design

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Reliability Test Result

Manufacturing Data

Explanation for Marking

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RD3P200SN ESD Data

Characteristics Data

Inner Structure

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Constitution Materials List

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Types and Features of Transistors

Application Note

TO-252_TL1 Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Create Symbols for PSpice Models

Models

Report of SVHC under REACH Regulation

Environmental Data

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design