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Discrete Semiconductor Products

R6007KND3TL1

Active
Rohm Semiconductor

NCH 600V 7A, TO-252 (DPAK), HIGH-SPEED SWITCHING POWER MOSFET

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Search across all available documentation for this part.

DocumentsAbout Flammability of MaterialsPower Eco Family: Overview of ROHM's Power Semiconductor Lineup+27
Product dimension image
Discrete Semiconductor Products

R6007KND3TL1

Active
Rohm Semiconductor

NCH 600V 7A, TO-252 (DPAK), HIGH-SPEED SWITCHING POWER MOSFET

Deep-Dive with AI

DocumentsAbout Flammability of MaterialsPower Eco Family: Overview of ROHM's Power Semiconductor Lineup+27

Technical Specifications

Parameters and characteristics for this part

SpecificationR6007KND3TL1
Current - Continuous Drain (Id) @ 25°C7 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs14.5 nC
Input Capacitance (Ciss) (Max) @ Vds470 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Power Dissipation (Max)78 W
Rds On (Max) @ Id, Vgs620 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.33
10$ 1.49
100$ 1.02
500$ 0.81
1000$ 0.75
Digi-Reel® 1$ 2.33
10$ 1.49
100$ 1.02
500$ 0.81
1000$ 0.75
Tape & Reel (TR) 2500$ 0.68
5000$ 0.64
NewarkEach (Supplied on Cut Tape) 1$ 2.12
10$ 1.52
25$ 1.36
50$ 1.21
100$ 1.05
250$ 0.94
500$ 0.84
1000$ 0.77

Description

General part information

R6007KND3 Series

R6007KND3 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

About Flammability of Materials

Environmental Data

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

R6007KND3 ESD Data

Characteristics Data

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Types and Features of Transistors

Application Note

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Explanation for Marking

Package Information

Package Dimensions

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article