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Discrete Semiconductor Products

R6007KND3TL1

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Rohm Semiconductor

NCH 600V 7A, TO-252 (DPAK), HIGH-SPEED SWITCHING POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

R6007KND3TL1

Active
Rohm Semiconductor

NCH 600V 7A, TO-252 (DPAK), HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6007KND3TL1
Current - Continuous Drain (Id) @ 25°C7 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]14.5 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]470 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)78 W
Rds On (Max) @ Id, Vgs620 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.33
10$ 1.49
100$ 1.02
500$ 0.81
1000$ 0.75
Digi-Reel® 1$ 2.33
10$ 1.49
100$ 1.02
500$ 0.81
1000$ 0.75
N/A 2486$ 2.13
Tape & Reel (TR) 2500$ 0.68
5000$ 0.64
NewarkEach (Supplied on Cut Tape) 1$ 2.12
10$ 1.52
25$ 1.36
50$ 1.21
100$ 1.05
250$ 0.94
500$ 0.84
1000$ 0.77

Description

General part information

R6007KND3 Series

R6007KND3 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

R6007KND3 Data Sheet

Data Sheet

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice&reg; Models

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

R6007KND3 ESD Data

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Explanation for Marking

Package Information

TO-252_TL1 Taping Information

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information