Specification	LPC4370FET256E

Connectivity	SPI, CANbus, EBI/EMI, SSC, IrDA, UART/USART, Ethernet, USB, I2C, SD
Core Processor	ARM® Cortex®-M4, ARM® Cortex®-M0
Core Size	32-Bit Tri-Core
Data Converters	A/D 16x10b, 6x12b, D/A 1x10b
Mounting Type	Surface Mount
Number of I/O	164 I/O
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	256-LBGA
Peripherals	WDT, I2S, Brown-out Detect/Reset, POR, PWM, LCD, DMA
Program Memory Type	ROMless
RAM Size	282 K
Speed	204 MHz
Supplier Device Package	256-LBGA (17x17)
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	2.2 V

LPC4370 Series

Part	Connectivity	Peripherals	Program Memory Type	Speed	Mounting Type	Data Converters	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Core Size	Core Processor	Supplier Device Package	Oscillator Type	Number of I/O	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	RAM Size
Freescale Semiconductor - NXP LPC4370FET256E	CANbus EBI/EMI Ethernet I2C IrDA SD SPI SSC UART/USART USB	Brown-out Detect/Reset DMA I2S LCD POR PWM WDT	ROMless	204 MHz	Surface Mount	6x12b A/D 16x10b D/A 1x10b	85 °C	-40 °C	256-LBGA	32-Bit Tri-Core	ARM® Cortex®-M0 ARM® Cortex®-M4	256-LBGA (17x17)	Internal	164 I/O	2.2 V	3.6 V	282 K
Freescale Semiconductor - NXP LPC4370FET100K	CANbus EBI/EMI Ethernet I2C IrDA SD SPI SSC UART/USART USB	Brown-out Detect/Reset DMA I2S POR PWM WDT	ROMless	204 MHz	Surface Mount	1x10b 3x12b SAR	85 °C	-40 °C		32-Bit Tri-Core	ARM® Cortex®-M0 ARM® Cortex®-M4	100-TFBGA (9x9)	Internal	49	2.2 V	3.6 V	282 K

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Enhanced trace module and enhanced trace buffer support

Non-maskable Interrupt (NMI) input

JTAG and serial wire debug (SWD), serial trace, eight breakpoints and four watch points

Technical documentation and resources