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Discrete Semiconductor Products

RBR3MM40BTFTR

Active
Rohm Semiconductor

LOW VF, 40V, 3A, SOD-123FL, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

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Product dimension image
Discrete Semiconductor Products

RBR3MM40BTFTR

Active
Rohm Semiconductor

LOW VF, 40V, 3A, SOD-123FL, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRBR3MM40BTFTR
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr100 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-123F
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackagePMDU
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V
Voltage - Forward (Vf) (Max) @ If580 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.49
10$ 0.38
100$ 0.23
500$ 0.21
1000$ 0.14
Digi-Reel® 1$ 0.49
10$ 0.38
100$ 0.23
500$ 0.21
1000$ 0.14
N/A 1060$ 0.46
Tape & Reel (TR) 3000$ 0.13
6000$ 0.13
9000$ 0.11
30000$ 0.11
75000$ 0.11
NewarkEach (Supplied on Cut Tape) 1$ 0.42
10$ 0.30
25$ 0.28
50$ 0.27
100$ 0.26
250$ 0.23
500$ 0.20
1000$ 0.17

Description

General part information

RBR3MM40 Series

RBR3MM40BTF is low VFhigh reliability Schottky Barrier Diode, suitable for general rectification.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Constitution Materials List

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

Moisture Sensitivity Level - Diodes

Package Information

How to Select Rectifier Diodes

Technical Article

What Is Thermal Design

Thermal Design

Reliability Test Result

Manufacturing Data

Power Loss and Thermal Design of Diodes

Thermal Design

How to Create Symbols for PSpice Models

Models

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

ESD Data

Characteristics Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Explanation for Marking

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Taping Information

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes

Technical Article

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Diode Types and Applications

Technical Article

RBR3MM40BTF Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Part Explanation

Application Note

Report of SVHC under REACH Regulation

Environmental Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Anti-Whisker formation - Diodes

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

About Flammability of Materials

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Export Regulations

Export Information

Inner Structure

Package Information