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Discrete Semiconductor Products

UM6K34NTCN

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Rohm Semiconductor

MOSFET, DUAL N-CH, 50V, SOT-363

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Product dimension image
Discrete Semiconductor Products

UM6K34NTCN

Active
Rohm Semiconductor

MOSFET, DUAL N-CH, 50V, SOT-363

Technical Specifications

Parameters and characteristics for this part

SpecificationUM6K34NTCN
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C200 mA
Drain to Source Voltage (Vdss)50 V
FET Feature0.9 V
FET FeatureLogic Level Gate
Input Capacitance (Ciss) (Max) @ Vds [Max]26 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-363, SC-88, 6-TSSOP
Power - Max [Max]120 mW
Supplier Device PackageUMT6
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id800 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 12309$ 0.41
NewarkEach (Supplied on Cut Tape) 1$ 0.41
10$ 0.26
25$ 0.23
50$ 0.20
100$ 0.17
250$ 0.14
500$ 0.12
1000$ 0.10

Description

General part information

UM6K34N Series

Complex type MOSFETs(N+N) are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

About Flammability of Materials

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Part Explanation

Application Note

Taping Information

Package Information

Compliance of the RoHS directive

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

ESD Data

Characteristics Data

Package Dimensions

Package Information

Explanation for Marking

Package Information

Inner Structure

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Create Symbols for PSpice Models

Models

UM6K34N Data Sheet

Data Sheet

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Reliability Test Result

Manufacturing Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design