Connectors, Interconnects

115-87-320-41-001101

Active

CONN IC DIP SOCKET 20POS GOLD

Connectors, Interconnects

Active

CONN IC DIP SOCKET 20POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	115-87-320-41-001101

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	Flash
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Open Frame
Grid Columns	10
Grid Rows	2
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	20
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.3 in
Termination	Solder
Type	DIP, 0.3" (7.62mm) Row Spacing

Part	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Mating	Row Spacing	Type	Pitch - Mating	Pitch - Post	Housing Material	Features	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Post	Termination	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Mating
Preci-Dip 115-87-320-41-001101	2	10	20	Tin	Flash	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper
Preci-Dip 115-83-648-41-003101	2	24	48	Tin		0.6 in	0.6" (15.24mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper	29.5 Ąin
Preci-Dip 115-87-322-41-001101	2	11	22	Tin	Flash	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper
Preci-Dip 115-83-424-41-003101	2	12	24	Tin		0.4 in	0.4" (10.16mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper	29.5 Ąin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Bulk	2160	$ 1.23	<5d
Mouser	N/A	620	$ 1.57	1w
		1000	$ 1.35
		2160	$ 1.26
		4320	$ 1.21

3D models and CAD resources for this part

General part information

CONN IC DIP SOCKET 20POS GOLD

Technical documentation and resources

No documents available