Connectors, Interconnects

115-87-320-41-001101

Active

CONN IC DIP SOCKET 20POS GOLD

Connectors, Interconnects

Active

CONN IC DIP SOCKET 20POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	115-87-320-41-001101

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	Flash
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Open Frame
Grid Columns	10
Grid Rows	2
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	20
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.3 in
Termination	Solder
Type	DIP, 0.3" (7.62mm) Row Spacing

Part	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Mating	Row Spacing	Type	Pitch - Mating	Pitch - Post	Housing Material	Features	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Post	Termination	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Mating
Preci-Dip 115-87-320-41-001101	2	10	20	Tin	Flash	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper
Preci-Dip 115-83-648-41-003101	2	24	48	Tin		0.6 in	0.6" (15.24mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper	29.5 Ąin
Preci-Dip 115-87-322-41-001101	2	11	22	Tin	Flash	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper
Preci-Dip 115-83-424-41-003101	2	12	24	Tin		0.4 in	0.4" (10.16mm) Row Spacing DIP	0.1 in	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Open Frame	Gold	125 °C	-55 °C	Brass	Solder	Through Hole	Beryllium Copper	29.5 Ąin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

3D models and CAD resources for this part

General part information

CONN IC DIP SOCKET 20POS GOLD

Technical documentation and resources

No documents available