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Discrete Semiconductor Products

DAN235UT106

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Rohm Semiconductor

RF DIODE STANDARD 35V 150MW UMD3

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Product thumbnail image
Discrete Semiconductor Products

DAN235UT106

Active
Rohm Semiconductor

RF DIODE STANDARD 35V 150MW UMD3

Technical Specifications

Parameters and characteristics for this part

SpecificationDAN235UT106
Capacitance @ Vr, F1.2 pF
Diode TypeStandard - 1 Pair Common Cathode
Operating Temperature125 ¯C
Package / CaseSC-70, SOT-323
Power Dissipation (Max) [Max]150 mW
Resistance @ If, F900 mOhm
Supplier Device PackageUMD3
Voltage - Peak Reverse (Max) [Max]35 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.53
10$ 0.33
25$ 0.27
100$ 0.21
250$ 0.18
500$ 0.16
1000$ 0.14
Digi-Reel® 1$ 0.53
10$ 0.33
25$ 0.27
100$ 0.21
250$ 0.18
500$ 0.16
1000$ 0.14
Tape & Reel (TR) 3000$ 0.08
6000$ 0.08
NewarkEach 1$ 0.58
10$ 0.28
100$ 0.18
500$ 0.16
1000$ 0.14
2500$ 0.11
12000$ 0.09

Description

General part information

DAN235U Series

Band Switching Diode

Documents

Technical documentation and resources

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

ESD Data

Characteristics Data

Moisture Sensitivity Level - Diodes

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Constitution Materials List

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

DAN235U Data Sheet

Data Sheet

Diode Types and Applications

Technical Article

About Export Regulations

Export Information

How to Create Symbols for PSpice Models

Models

Explanation for Marking

Package Information

Part Explanation

Application Note

Taping Information

Package Information