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TOREX XC6215B182MR-G
Discrete Semiconductor Products

QS5U17TR

Active
Rohm Semiconductor

2.5V DRIVE NCH+SBD MOSFET

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TOREX XC6215B182MR-G
Discrete Semiconductor Products

QS5U17TR

Active
Rohm Semiconductor

2.5V DRIVE NCH+SBD MOSFET

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationQS5U17TR
Current - Continuous Drain (Id) @ 25°C2 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]2.5 V
Drive Voltage (Max Rds On, Min Rds On) [Min]4.5 V
FET FeatureSchottky Diode (Isolated)
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs3.9 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]175 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-5 Thin, TSOT-23-5
Power Dissipation (Max) [Max]900 mW
Rds On (Max) @ Id, Vgs100 mOhm
Supplier Device PackageTSMT5
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 8527$ 0.84
NewarkEach 1$ 0.91
10$ 0.68
100$ 0.45
500$ 0.34
1000$ 0.31
2500$ 0.27
10000$ 0.23

Description

General part information

QS5U17 Series

ROHM MOSFETs are made as low RDS(on) resistance devices utilizing the micro-processing technologies and available in wide lineup including hybrid types (MOSFET + Schottky Barrier Diode) to meet various needs in the market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Inner Structure

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article