IRLML5103TRPBF
ActivePOWER MOSFET, P CHANNEL, 30 V, 760 MA, 0.6 OHM, SOT-23, SURFACE MOUNT
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IRLML5103TRPBF
ActivePOWER MOSFET, P CHANNEL, 30 V, 760 MA, 0.6 OHM, SOT-23, SURFACE MOUNT
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Technical Specifications
Parameters and characteristics for this part
| Specification | IRLML5103TRPBF |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 760 mA |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V, 4.5 V |
| FET Type | P-Channel |
| Gate Charge (Qg) (Max) @ Vgs | 5.1 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 75 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | SOT-23-3, TO-236-3, SC-59 |
| Power Dissipation (Max) | 540 mW |
| Rds On (Max) @ Id, Vgs | 600 mOhm |
| Supplier Device Package | Micro3™/SOT-23 |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 1 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.36 | |
| 10 | $ 0.23 | |||
| 100 | $ 0.15 | |||
| 500 | $ 0.13 | |||
| 1000 | $ 0.11 | |||
| Digi-Reel® | 1 | $ 0.36 | ||
| 10 | $ 0.23 | |||
| 100 | $ 0.15 | |||
| 500 | $ 0.13 | |||
| 1000 | $ 0.11 | |||
| N/A | 15473 | $ 0.36 | ||
| Tape & Reel (TR) | 3000 | $ 0.09 | ||
| 6000 | $ 0.08 | |||
| 9000 | $ 0.07 | |||
| 15000 | $ 0.07 | |||
| 21000 | $ 0.07 | |||
| 30000 | $ 0.06 | |||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 0.37 | |
| 10 | $ 0.24 | |||
| 25 | $ 0.21 | |||
| 50 | $ 0.18 | |||
| 100 | $ 0.15 | |||
| 250 | $ 0.14 | |||
| 500 | $ 0.13 | |||
| 1000 | $ 0.12 | |||
Description
General part information
IRLML5103 Series
The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications.The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design.
Documents
Technical documentation and resources