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RB717FT106
Discrete Semiconductor Products

RB717FT106

Active
Rohm Semiconductor

40V, 30MA, SOT-323, SCHOTTKY BARRIER DIODE

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RB717FT106
Discrete Semiconductor Products

RB717FT106

Active
Rohm Semiconductor

40V, 30MA, SOT-323, SCHOTTKY BARRIER DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRB717FT106
Current - Average Rectified (Io) (per Diode)30 mA
Current - Reverse Leakage @ Vr1 µA
Diode Configuration1 Pair Common Anode
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]125 °C
Package / CaseSOT-323, SC-70
Speed200 mA
SpeedAny Speed
Supplier Device PackageUMD3
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V
Voltage - Forward (Vf) (Max) @ If [Max]370 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 12133$ 0.37

Description

General part information

RB717F Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.

Documents

Technical documentation and resources

RB717F Data Sheet

Data Sheet

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Part Explanation

Application Note

List of Diode Package Thermal Resistance

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Explanation for Marking

Package Information

Anti-Whisker formation - Diodes

Package Information

Diode Types and Applications

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Select Rectifier Diodes

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Package Dimensions

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Taping Information

Package Information

Reliability Test Result

Manufacturing Data

How to Create Symbols for PSpice Models

Models

What is a Thermal Model? (Diode)

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

About Export Regulations

Export Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Inner Structure

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification