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SOT1023
Discrete Semiconductor Products

PSMN1R5-50YLHX

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Nexperia USA Inc.

N-CHANNEL 50 V, 1.7 MOHM, 200 A CONTINUOUS, LOGIC LEVEL APPLICATION SPECIFIC MOSFET IN LFPAK56E

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SOT1023
Discrete Semiconductor Products

PSMN1R5-50YLHX

Active
Nexperia USA Inc.

N-CHANNEL 50 V, 1.7 MOHM, 200 A CONTINUOUS, LOGIC LEVEL APPLICATION SPECIFIC MOSFET IN LFPAK56E

Technical Specifications

Parameters and characteristics for this part

SpecificationPSMN1R5-50YLHX
Current - Continuous Drain (Id) @ 25°C200 A
Drain to Source Voltage (Vdss)50 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs181 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]11143 pF
Mounting TypeSurface Mount
Operating Temperature [Max]175 °C
Operating Temperature [Min]-55 °C
Package / CaseSOT-1023, 4-LFPAK
Power Dissipation (Max)333 W
Rds On (Max) @ Id, Vgs1.75 mOhm
Supplier Device PackagePower-SO8, LFPAK56
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2669$ 5.38

Description

General part information

PSMN1R5-50YLH Series

200 Amp continuous current, logic level gate drive, N-channel enhancement mode MOSFET in LFPAK56E package. Part of the ASFETs for Battery Isolation and DC Motor control family and using Nexperia’s unique "SchottkyPlus" technology delivers high efficiency and low spiking performance usually associated with MOSFETs with an integrated Schottky or Schottky-like diode but without problematic high leakage current. The ASFET is particularly suited to 36 V battery powered applications requiring strong avalanche capability, linear mode performance, use at high switching frequencies, and also safe and reliable switching at high load-current.

Documents

Technical documentation and resources

Product Quality Quick Reference Information

Quality document

Using power MOSFETs in parallel

Application note

LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout

Application note

plastic, single-ended surface-mounted package (LFPAK56E); 4 leads; 1.27 mm pitch

Package information

Low temperature soldering, application study

Application note

Understanding power MOSFET data sheet parameters

Application note

RC Thermal Models

Application note

Foster thermal model PSMN1R5-50YLH

Thermal model

Maximum continuous currents in NEXPERIA LFPAK power MOSFETs

Application note

plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body

Marcom graphics

Nexperia package poster

Leaflet

N-channel 50 V, 1.7 mOhm, 200 A continuous, logic level Application Specific MOSFET in LFPAK56E

Data sheet

Power MOSFET gate driver fundamentals

Application note

Reflow soldering profile

Reflow soldering

Understanding power MOSFET data sheet parameters

Application note

Failure signature of Electrical Overstress on Power MOSFETs

Application note

Designing in MOSFETs for safe and reliable gate-drive operation

Application note

Questions about package outline drawings

Application note

Reliability qualification information

Quality document

Power MOSFET single-shot and repetitive avalanche ruggedness rating

Application note

LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation

Packing information

Cauer thermal model PSMN1R5-50YLH

Thermal model

Designing RC Snubbers

Application note