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ATS-KRP-3559-C1-R0

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HEAT SINKS HEAT SINK FOR AMD XILINX KRIA K26 SOM DEVICE, PASSIVE, 54X68X20MM

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Fans, Blowers, Thermal Management

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HEAT SINKS HEAT SINK FOR AMD XILINX KRIA K26 SOM DEVICE, PASSIVE, 54X68X20MM

Technical Specifications

Parameters and characteristics for this part

Specification	ATS-KRP-3559-C1-R0

Attachment Method	Screw
Fin Height [z]	20 mm
Fin Height [z]	0.787 in
Length	2.126 in
Length	54 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	AMD Kria™ K26 SOM
Power Dissipation @ Temperature Rise	15 W, 55 °C
Shape [custom]	Rectangular
Shape [custom]	Fins
Thermal Resistance @ Forced Air Flow	1.2 °C/W
Type	Top Mount
Width [x]	68 mm
Width [x]	2.677 "

Part	Attachment Method	Thermal Resistance @ Forced Air Flow	Length	Length	Material	Package Cooled	Width [x]	Width [x]	Fin Height [z]	Fin Height [z]	Power Dissipation @ Temperature Rise	Material Finish	Shape [custom]	Shape [custom]	Type
Advanced Thermal Solutions Inc. ATS-KRP-3559-C1-R0	Screw	1.2 °C/W	2.126 in	54 mm	Aluminum	AMD Kria™ K26 SOM	68 mm	2.677 "	20 mm	0.787 in	15 W 55 °C	Black Anodized	Rectangular	Fins	Top Mount

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General part information

HEAT SINKS HEAT SINK FOR AMD XILINX KRIA K26 SOM DEVICE, PASSIVE, 54X68X20MM

Technical documentation and resources