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MR25H10MDCR
Integrated Circuits (ICs)

MR25H10MDCR

NRND
Everspin Technologies Inc.

MRAM 1MB 3V 128KX8 SERIAL MRAM

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MR25H10MDCR
Integrated Circuits (ICs)

MR25H10MDCR

NRND
Everspin Technologies Inc.

MRAM 1MB 3V 128KX8 SERIAL MRAM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationMR25H10MDCR
Clock Frequency40 MHz
GradeAutomotive
Memory Depth128 K
Memory FormatRAM
Memory Interface (Type)SPI
Memory Size1 Mbit
Memory TypeNon-Volatile
Memory Width8 bit
Mounting TypeSurface Mount
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Package / Case8-TDFN Exposed Pad
Package Length5 mm
Package NameLarge Flag, 8-DFN-EP
Package Width6 mm
QualificationAEC-Q100
TechnologyMRAM (Magnetoresistive RAM)
Voltage - Supply (Maximum)3.6 V
Voltage - Supply (Minimum)2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyN/A 0$ 10.091m+
MouserN/A 4000$ 8.901m+

CAD

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Description

General part information

MR25H10 Series

MRAM 1MB 3V 128KX8 SERIAL MRAM

Documents

Technical documentation and resources