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ISL8200AMEV1PHZ
Development Boards, Kits, Programmers

ISL8200AMEV1PHZ

Obsolete
Renesas Electronics Corporation

BOARD EVAL FOR ISL8200AM

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ISL8200AMEV1PHZ
Development Boards, Kits, Programmers

ISL8200AMEV1PHZ

Obsolete
Renesas Electronics Corporation

BOARD EVAL FOR ISL8200AM

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationISL8200AMEV1PHZ
Board TypeFully Populated
Current - Output10 A
Main PurposeDC/DC, Step Down
Outputs and TypeNon-Isolated
Outputs and Type1
Regulator TopologyBuck
Supplied ContentsBoard(s)
Utilized IC / PartISL8200AM
Voltage - Input [Max]20 V
Voltage - Input [Min]3 V
Voltage - Output [Max]6 VDC
Voltage - Output [Min]0.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 109.66

Description

General part information

ISL8200AM Series

The ISL8200AM is a simple and easy to use high power, current-sharing DC/DC power module for datacom, telecom, and FPGA power hungry applications. All that is needed is the ISL8200AM, a few passive components, and one VOUTsetting resistor to have a complete 10A design ready for market. The ease of use practically eliminates design and manufacturing risks while dramatically improving time to market. Parallel up to six ISL8200AM modules to scale up to a 60A solution for more output current. The simplicity of the ISL8200AM is in its "off-the-shelf", unassisted implementation compared to a discrete implementation. Patented current sharing in multiphase operation greatly reduces ripple currents, BOM cost, and complexity. For example, parallel two devices for 20A of current and up to six for 60A of current. The output voltage can be precisely regulated to as low as 0. 6V with ±1% output voltage regulation over line, load, and temperature variations. The ISL8200AM’s thermally enhanced, compact QFN package operates at full load and over-temperature without requiring forced air cooling. The package is so thin it can even fit on the backside of the PCB. Easy access to all pins with few external components reduces the PCB design to a component layer and a simple ground layer.

Documents

Technical documentation and resources