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Discrete Semiconductor Products

HP8JE5TB1

Active
Rohm Semiconductor

MOSFET, DUAL P-CH, 100V, 12.5A, HSOP ROHS COMPLIANT: YES

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Product dimension image
Discrete Semiconductor Products

HP8JE5TB1

Active
Rohm Semiconductor

MOSFET, DUAL P-CH, 100V, 12.5A, HSOP ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationHP8JE5TB1
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C4.5 A, 12.5 A
Drain to Source Voltage (Vdss)100 V
Gate Charge (Qg) (Max) @ Vgs38 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1370 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power - Max3 W, 21 W
Rds On (Max) @ Id, Vgs127 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2500$ 2.81
NewarkEach (Supplied on Cut Tape) 1$ 2.84
10$ 1.63
25$ 1.53
50$ 1.41
100$ 1.31
250$ 1.14
500$ 1.05
1000$ 0.96

Description

General part information

HP8JE5 Series

HP8JE5 is a low on-resistance MOSFET ideal for Switching and Motor drives applications.

Documents

Technical documentation and resources

Compliance of the RoHS directive

Environmental Data

Taping Information

Package Information

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

HP8JE5 Data Sheet

Data Sheet

What is a Thermal Model? (Transistor)

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

HSOP8(Symmetry Dual) Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Part Explanation

Application Note

Explanation for Marking

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

HP8JE5 ESD Data

Characteristics Data

Package Dimensions

Package Information

Report of SVHC under REACH Regulation

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Anti-Whisker formation - Transistors

Package Information

P-channel Power MOSFETs selection guide

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification